This category contains companies that manufacture custom semiconductors, semiconductor packaging, or fabricate wafers on a contract basis.
Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
An independent subcontractor for semiconductor assembly, test and packaging services.
Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom.
A fabless design house focused on RF and high-speed digital integrated designs.
Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
Fabricates analog and mixed-signal ICs
Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
Offers custom layout and fabrication services for emerging companies and university groups.
European supplier of advanced semiconductor burn-in and reliability test systems.
Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
Provides semiconductor IC assembly and testing services.
Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Include capabilities, and illustrated discussions of packaging technologies and processes.
Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
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