Compound semiconductor foundry service provider for wireless telecommunication, high-speed networking, opto-electronics and automotive industries, located in Torrance, CA, USA.
Offers wafer grinding, dicing, polishing and flip chip service to transfer wafer dice to tape and reel.
Silicon Valley based wafer foundry offering 4", 5", 6", 8", and 12" wafers for 100-300mm. Also offers wafer reclamation and recycling services and products.
Provide wafering and polishing services of semiconductors and industrial crystals to laboratories and industrial customers.
Specializing in semiconductor wafer precision grinding. Chandler, AZ, USA.
Full service supplier of 3" to 8" silicon wafers and related services, including polishing, reclaiming, thermal oxide and back-grinding. Located in Santa Clara, California.
Manufactures products for various applications covering a variety of computer, communications and consumer electronics market segments.
Provides silicon, sapphire, GaAs, silicon carbide, germanium, and other material wafers to companies and universities. List of materials and current stock.
Offers thinning silicon, GaAs, InP, InSb, GaSb, GaP or any other semiconductor or insulating material wafers or dice. East and West coast, USA, facilities.
Provides 4", 5" and 6" prime polished silicon wafers. Has manufacturing plants in Shanghai, PRC, and California, U.S.A., in addition to the headquarters and factory in Yang-Mei, Taiwan.
Manufactures small diameter silicon wafers for reclaim, test, prime, and double-side polish specifications in research and production quantities. Wafer specifications, pricing, and online order form.
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